LED SF (GROUP FAULT) 5 PIECES PER PACKAGING UNIT MODULES FOR ET 200S, 4 DI HIGH FEATURE 24V DC, 15 MM WIDTH WITH PARAM. MODULES FOR ET 200S, 4 DI STANDARD 24V DC, 15 MM WIDTH, 5 PIECES PER PACKAGING UNIT MODULES FOR ET 200S, 2 DI HIGH FEATURE 24V DC, 15 MM WIDTH WITH PARAM. MODULES FOR ET 200S, 2 DI STANDARD 24V DC, 15 MM WIDTH, 5 PIECES PER PACKAGING UNIT Made using the insulation displacement method. The ET 200M distributed I/O system is modularly designed The cable is simply plugged in and the contact is FastConnect plugs do not require the cables to be Single conductors and a complete plug-in modular system areĪvailable. In addition to screw-type and spring-loaded terminals, connection of the signals can be made even simpler and faster using SIMATIC TOP connect. Hot swapping and expansion of modules is permissible when using active bus modules.Ĭonnection to PROFINET and PROFIBUS is made via interface 64 digital inputs) and function modulesĪs well as S7-300 communications processors can be usedĪs I/O modules – the interface to the process. Up to 12 multi-channel signal modules (e.g.
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